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Cooler Master Computex 2026 Announced
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Cooler Master announced a headquarters showcase during Computex 2026 focused on the thermal engineering demands shaping the next era of computing. Under the theme Thermal Authority, Every AI Reality, Cooler Master will present advanced cooling hardware, workstation platforms, and full-system designs that connect its work across AI data centers, enterprise infrastructure, workstations, and desktop systems. Cooler Master's headquarters showcase will take place June 2-5, 2026, from 9 a.m. to 5 p.m. at Cooler Master headquarters in Taipei. The headquarters showcase will also introduce updates across Cooler Master's core product categories. New flagship products such as HAF II 500, a high-airflow chassis built around large-format fan performance, and V8 ACE 3DHP, a formidable air cooler carrying patented 3D Heat Pipe technology lead the lineup. Cooler Master will also launch MWE Gold V4 featuring GPU Shield technology for real time active GPU protection, and the newly announced MasterDimm memory modules in partnership with G.SKILL bring Cooler Master into an all-new product category. Additional products across all component categories will also be on display. Cooler Master will present its work in datacenter and industrial cooling, where AI infrastructure is creating new thermal demands at chip, rack, and facility scale. The showcase will highlight Cooler Master Corporation's work in liquid cooling development, including cold plate technology, pumped two-phase cooling, CDU architecture, and rack-scale thermal systems developed for high-density AI infrastructure. Cooler Master will also reveal advanced system concepts and workstation platforms designed for AI inference, simulation, CAD, rendering, and development workloads. These systems show how cooling capacity, airflow pathing, power delivery, and component layout come together when performance depends on more than a single part. Supporting technologies include high-capacity radiator configurations, MasterDimm memory cooling, and the V Platinum 3000 workstation power supply. Demonstrating its work across enterprise and consumer applications, Cooler Master will present technologies designed to manage heat transfer, liquid movement, airflow, acoustic behavior, and power stability across multiple products and systems. Demonstrations will include chip-level cooling technologies, liquid cooling architecture, 3DHP technology, fan performance, GPU airflow solutions, and GPU Shield power-management technology.
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Quelle: coolermaster.com (E)
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(E)